高性能SMD开关稳压器
RPX: 超紧凑型QFN封装电源模块
RPX 模块之所以与众不同，是因为采用了倒装芯片技术提高了功率密度并改善了热管理。
RECOM的新型电源模块RPX-1.0、RPX-1.5和PRX-2.5系列均采用热增强型QFN封装（SMD），具有高功率密度，在无强制风冷的条件下，模块工作温度可高达85°C。在3mm x 5mm x 1.6mm QFN封装尺寸中，1A和1.5A版本的输入电压高达36 VDC，低至4 VDC，可接受5V、12V、15V或24V非稳压输入。使用两个电阻可将输出电压设置在0.8 VDC到30 VDC范围内。
采用4mmx 4.5mmx 2.0mm QFN封装尺寸的2.5A版本的输入电压范围从4.5VDC到高达28 VDC，可接受5V、12V、15V或24V电压输入。使用两个电阻可将输出电压设置在1.2VDC到最高6VDC范围内。
RPX 系列现在也提供 -Q 型号，符合汽车标准 AEC-Q100 1 级，工作温度可达 +125°C。这些部件具有「可润湿」侧翼，有助于对栅格数组焊点进行自动光学检查。
采用4mmx 4.5mmx 2.0mm QFN封装尺寸的2.5A版本的输入电压范围从4.5VDC到高达28 VDC，可接受5V、12V、15V或24V电压输入。使用两个电阻可将输出电压设置在1.2VDC到最高6VDC范围内。
RPX 系列现在也提供 -Q 型号，符合汽车标准 AEC-Q100 1 级，工作温度可达 +125°C。这些部件具有「可润湿」侧翼，有助于对栅格数组焊点进行自动光学检查。
主要特点：
- 具有集成电感器的先进3D封装电源模块，可在QFN封装中实现最小的板载空间。
- 先进的热管理设计允许模块在高达+ 105°C的温度下运行，而无需强制风冷。
- 1A、1.5A或2.5A输出电流可选
- 只需2个电阻便可设置可调输出电压
- 在广泛的负载范围内（5％至100％）恒定、高效
- 宽工作温度范围：-40 °至+105 °C或更高@满载
- 效率高达91%，无需散热器
- 完善的保护功能：SCP, OCP, OTP 和可调UVLO
- 简单的Class A 或Class B EMC滤波器
应用：
- 工业及电机控制
- 自动化测试设备
- 医疗及影像设备
- 电池供电设备
- 高密度板载电源
- 电源轨电流高达2.5A
RPX
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPX-0.5Q
Focus
新
| 0.5 | 4.0 - 36.0 | 0.8 to 34 | SMD (pinless) | QFN | |
| 2 |
|
RPX-1.0
Focus
| 1.0 | 4.0 - 36.0 | 0.8 to 24 | SMD (pinless) | QFN | |
| 3 |
|
RPX-1.5
Focus
| 1.5 | 4.0 - 36.0 | 0.8 to 24 | SMD (pinless) | QFN | |
| 4 |
|
RPX-1.5Q
Focus
新
| 1.5 | 4.0 - 36.0 | 0.8 to 30 | SMD (pinless) | QFN | |
| 5 |
|
RPX-2.5
Focus
| 2.5 | 4.5 - 28.0 | 1.2 to 6 | SMD (pinless) | QFN | |
| 6 |
|
RPX-4.0
Focus
| 4.0 | 3.8 - 36.0 | 1 to 7 | SMD (pinless) | QFN | |
| 7 |
|
RPX-4.0-EVM-1
Focus
| 4.0 | 4.0 - 36.0 | 1 to 7 | Open Frame | ||
| 8 |
|
RPX-1.0-EVM-1
| 1.0 | 4.0 - 36.0 | 0.8 to 24 | Open Frame | ||
| 9 |
|
RPX-1.5-EVM-1
| 1.5 | 4.0 - 36.0 | 0.8 to 24 | Open Frame | ||
| 10 |
|
RPX-2.5-EVM-1
| 2.5 | 4.5 - 28.0 | 1.2 to 6 | Open Frame |
The RPL 3.0 from RECOM point of load converter is just 3 x 3mm with a wide input and output range
The RECOM RPL 3.0 is a 3 amp point of load buck converter in a tiny 3 x 3mm 10-pad thermally-enhanced LGA package with a 1.45mm profile. Input range is 4V to 18V and the output is adjustable from 0.8V to 5.2V, set by external resistors. Following RECOM’s ‘Power Packaging’ concept, the inductor is integrated and the control IC is embedded within the substrate for outstanding electrical and thermal performance.
Comprehensive functionality is provided with output voltage sensing, on/off control, a power good signal and full protection against short circuits, over-voltage, over-temperature and overload. With derating, the part can operate reliably at ambients over 110°C.
Applications for this high-efficiency converter include distributed power architectures and where high power density and low profile is important, such as in portable devices, imaging systems and telecom/industrial generally. An evaluation board RPL-3.0-EVM-1 is available on request.
Comprehensive functionality is provided with output voltage sensing, on/off control, a power good signal and full protection against short circuits, over-voltage, over-temperature and overload. With derating, the part can operate reliably at ambients over 110°C.
Applications for this high-efficiency converter include distributed power architectures and where high power density and low profile is important, such as in portable devices, imaging systems and telecom/industrial generally. An evaluation board RPL-3.0-EVM-1 is available on request.
主要特点：
- Advanced ‘3D Power Packaging’ concept with integrated inductor and substrate-embedded control IC (RPL-3.0)
- Advanced thermal design for reliable high-temperature performance above 110°C
- 1A, 2A, 3A and 15A rated outputs
- Input ranges from 4V to 18VDC
- Output ranges are adjustable, covering 0.6V to 17VDC
- The highest power density in the class
- Fully featured
- Fully protected
- Minimal filtering is required for Class A or B
应用：
- Portable equipment
- Low profile products
- Telecoms
- Industrial
- Medical and Imaging systems
- Point-of-load regulation
RPL
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPL-3.0
Focus
| 3.0 | 4.0 - 18.0 | 0.8 to 5.2 | SMD (pinless) | 10 pad LGA | |
| 2 |
|
RPL-3.0-EVM-1
Focus
| 3.0 | 4.0 - 18.0 | 1.8 to 5.2 | Open Frame |
在欧洲制造符合DOSA的超薄型转换器！
RECOM的最新创新技术将超薄型DC/DC转换器的功率密度提高到一个新的水平。
RPM电源模块的设计、测试和制造全在欧洲完成！模块是SMD，采用平面网格阵列封装(LGA)，同时包含输入和输出电容。RPM系列无需额外器件即可可靠运行。
RPM模块因其高达99%的出色效率脱颖而出，超薄型封装能够完美地在空间有限的应用中使用。这些模块是市场上紧凑型封装且功率密度最高的产品之一，高度仅3.75mm。它们在相同尺寸的封装中可提供1、2、3甚至6A的输出电流。
6A模块的功率密度比市场同类产品高出至少50%，这要归功于新的IC和创新的多层PCB布局。经过热优化之后，热量可从电路板引出，因此无需降额即可在环温高达90°C时提供功率密度超过800W/in³。由于PCB有接地平面和金属外壳，6面屏蔽可确保出色的EMC性能。
RPM电源模块的设计、测试和制造全在欧洲完成！模块是SMD，采用平面网格阵列封装(LGA)，同时包含输入和输出电容。RPM系列无需额外器件即可可靠运行。
RPM模块因其高达99%的出色效率脱颖而出，超薄型封装能够完美地在空间有限的应用中使用。这些模块是市场上紧凑型封装且功率密度最高的产品之一，高度仅3.75mm。它们在相同尺寸的封装中可提供1、2、3甚至6A的输出电流。
6A模块的功率密度比市场同类产品高出至少50%，这要归功于新的IC和创新的多层PCB布局。经过热优化之后，热量可从电路板引出，因此无需降额即可在环温高达90°C时提供功率密度超过800W/in³。由于PCB有接地平面和金属外壳，6面屏蔽可确保出色的EMC性能。
主要特点：
- 高功率密度 (长*宽*高= 12.19*12.19*3.75 mm)
- 宽工作温度范围-40°C至满载+107°C
- 效率高达99%，无需散热器
- 6面屏蔽
- 25个平面网格封装焊盘，增强了散热和EMI性能
- 紧凑型工业标准封装
- 轻薄型
应用：
- 工业
- 网络
- 存储
- FPGA
- 电池供电设备
- 电信
- POL应用
尺寸规格
尺寸规格 (毫米)
RPM
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPM-1.0
Focus
| 1.0 | 3.0 - 17.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 2 |
|
RPM-2.0
Focus
| 2.0 | 3.0 - 17.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 3 |
|
RPM-3.0
Focus
| 3.0 | 3.0 - 17.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 4 |
|
RPM-6.0
Focus
| 6.0 | 4.0 - 15.0 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |
| 5 |
|
RPM-1.0-EVM-1
| 1.0 | 3.0 - 17.0 | 0.9 to 6 | Open Frame | ||
| 6 |
|
RPM-2.0-EVM-1
| 2.0 | 3.0 - 17.0 | 0.9 to 6 | Open Frame | ||
| 7 |
|
RPM-3.0-EVM-1
| 3.0 | 3.0 - 17.0 | 0.9 to 6 | Open Frame | ||
| 8 |
|
RPM-6.0-EVM-1
| 6.0 | 4.0 - 15.0 | 0.9 to 6 | Open Frame |
SMD LGA管脚封装的开关稳压器的输入电压目前可高达36V
RPMB 2A和3A 开关稳压器输出电压高达24V，输入电压最高为36V。
标准尺寸为12.19 x 12.19 x 3.75mm ，符合DOSA的热增强LGA封装。预设输出为3.3V（1-9V可调）、5V（1-9V可调）、12V（9-24V可调）或15V（9-24V可调）。所有型号都可提供500mV或更低的低压差。
标准尺寸为12.19 x 12.19 x 3.75mm ，符合DOSA的热增强LGA封装。预设输出为3.3V（1-9V可调）、5V（1-9V可调）、12V（9-24V可调）或15V（9-24V可调）。所有型号都可提供500mV或更低的低压差。
RPMB
| Series | Current (A) | Vin (V) | Trim Pin Output Voltage Adjustment | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPMB-2.0
Focus
| 2.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | SMD (pinless) | 25 pad LGA | |
| 2 |
|
RPMB-3.0
Focus
| 3.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | SMD (pinless) | 25 pad LGA | |
| 3 |
|
RPMB-2.0-EVM-1
| 2.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | Open Frame | ||
| 4 |
|
RPMB-3.0-EVM-1
| 3.0 | 4.0 - 36.0, 5.5 - 36.0, 12.8 - 36.0, 16.0 - 36.0 | 1-9, 9-24 | Open Frame |
重大突破！SMD LGA管脚封装的开关稳压器输入电压范围可达4.3V至65V！
符合DOSA LGA封装的薄型RPMH-0.5系列0.5A 开关稳压器，输入电压范围为4.3V至65V
RPMH系列输出电流为0.5A，可输出5种电压为：3.3V (+10%/-20%)、5V (+10%/-20%)、12V (+10%/-40%)、15V (+10%/-40%)或24V (+17%/-37%)。输入电压最高可达65V，压差可以低至1V-1.5V，适用于使用标称5、12、24或48V电源轨系统。
RPMH系列输出电流为0.5A，可输出5种电压为：3.3V (+10%/-20%)、5V (+10%/-20%)、12V (+10%/-40%)、15V (+10%/-40%)或24V (+17%/-37%)。输入电压最高可达65V，压差可以低至1V-1.5V，适用于使用标称5、12、24或48V电源轨系统。
RPMH
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||
|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPMH-0.5
Focus
| 0.5 | 4.3 - 65.0, 6.0 - 65.0, 13.5 - 65.0, 16.5 - 65.0, 25.5 - 65.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | SMD (pinless) | 25 pad LGA | |
| 2 |
|
RPMH-1.5
Focus
| 1.5 | 5.0 - 60.0, 7.0 - 60.0, 14.0 - 60.0, 17.0 - 60.0, 26.0 - 60.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | SMD (pinless) | 25 pad LGA | |
| 3 |
|
RPMH-0.5-EVM-1
| 0.5 | 4.3 - 65.0, 6.0 - 65.0, 13.5 - 65.0, 16.5 - 65.0, 25.5 - 65.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | Open Frame | ||
| 4 |
|
RPMH-1.5-EVM-1
| 1.5 | 5.0 - 60.0, 7.0 - 60.0, 14.0 - 60.0, 17.0 - 60.0, 26.0 - 60.0 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | Open Frame |